Since recently, the TME offer includes products from Advanced Thermal Solutions, American manufacturer of heat sinks and components for dissipating heat from electronic devices.
maxiFLOW™ series heat sinks – key information
The Advanced Thermal Solutions product portfolio includes the unique maxiFLOW™ series of heat sinks which provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP. Additionally, the maxiFLOW™ series can be equipped with two innovative mounting systems: maxiGRIP™ and superGRIP™.
| maxiGRIP™ | superGRIP™ |
Discover the maxiFLOW™ series products »
Products by Advanced Thermal Solutions are applied wherever heat dissipation of electronic components and their protection against thermal damage is required.
Discover the wide range of Advanced Thermal Solutions products available at TME.
| Features: | |
| Material: | aluminium |
| Heat sink shape: | plate-fin |
| Heat sink type: | extruded |
| Material finishing: | anodized |